Flex & Rigid-Flex PCB Manufacturing Capability (2021)

Serial

Item

Flex PCB

Rigid-Flex PCB

1

Layers Counts

1- 12 Layers

2-16 Layers

2

Material Type

PI, PET, Kapton

PI+FR-4

3

Material Brand

SHENGYI, TAIFLEX, ITEQ, DuPont etc

4

Stiffener Material Type

FR-4, PI, PET, Steel, Al, Adhesive Tape

5

Min Board Thickness

1 Layer

0.05mm(2mil)

2 Layers

0.10mm(4mil)

0.20mm(8mil)

6

Max Board dimension

250*1000mm (9.84*39.37 inches)

7

Min Trace Width /                  Trace Spacing

Copper thickness: 0.5 oz

0.05/0.05mm(2/2mil)

Copper thickness: 0.5 oz-1oz

0.075/0.075mm(3/3mil)

Copper thickness: 1oz

0.10/0.10mm(4/4mil)

8

Min Hole Diameter (Mechanical drill)

0.15mm(6mil)

9

Min Hole Diameter (Laser drill)

0.10mm(4mil)

10

Min Annular Ring         (Outer layers)

1 Layer

0.10mm(4mil)

2 Layers

0.10mm(4mil)

11

Min Annular Ring         (Inner layers)

≧ 4Layers

0.10mm(4mil)

Min Annular Ring         (Outer layers)

0.10mm(4mil)

12

Coverlay thickness

12.5um, 25um, 50um

13

Min Coverlay Opening

0.40*0.40mm(16*16mil)

14

Min Solder mask Opening

0.15mm(6mil)

15

Min Coverlay Bridge

0.20mm(4mil)

Min Solder mask Bridge

0.13mm(5mil)

16

Via Type

Through Hole, Blind, Buried

17

Tolerance

PTH Hole

±0.075mm(±3mil)

NPTH Hole

±0.05mm(±2mil)

Outline

±0.10mm(±4mil)

Outside edge to Circuit

±0.10mm(±4mil)

18

Surface finished

ENIG, OSP, Immersion Silver, Immersion Tin, Glod Plating, Gold Plating+ENIG, Gold Plating+OSP

SMT Manufacturing Capability (2021)

Serial

Item

Manufacturing Capability in process

Manufacturing Method

1

Production size(Min/Max)

50×50mm / 510×460mm

2

Production board thickness

0.20~6.00mm

3

Printing solder paste

Support method

Magnetism fixture, Vacuo platform

Clamping method

Sticking up by vacuo, clamping on both sides ,flexible clamping with sheet, flexible clamping with thick board

Cleaning Method of printing solder paste

Dry method+ wetting method+ Vacuo method

Accuracy of printing

±0.02mm

4

SPI

Repeated accuracy of volume

<1% at 3σ

5

Mounting component

Components size

0603(Option)  

L75mm Connector

Online

Pitch

0.15mm

Repeated accuracy of volume

±0.01mm

6

AOI

FOV size

61×45mm

Online

Test speed(mm²/Sec)

9150

7

3D X-ray

Shooting angle(degrees)

0-45 degree

Online

DIP Manufacturing Capability (2021)

1

All plug-in components are tested for errors, omissions and misplacement of components using AOI to strictly control the pass rate of DIP processing.

2

Experienced soldering hands with strict training can control welding speed and quality.

3

According to the production status of PCB Assembly, a temporary storage area with independent identification should be equipped around the pull wire, such as waiting for plug-in area, waiting for maintenance area, waiting for QC inspection area, defective product area, waiting for QA inspection area, etc., to avoid the appearance of mixed boards.

4

Strict IPQC and QA LOT sampling inspection standards to ensure the reliability of DIP processing.

DIP Manufacturing equipment is as follows:

1

DIP Production lines x 2 sets.

2

AOI Equipment (Used to check DIP): Check for defects in plug-in components and solder joints.

3

Wave soldering x 2 sets.

4

Rear weld pull wire x 36 station.

5

Board washing machine x 1 set